Use Cases for Chiplets in AI Clusters

What's driving the surge in chiplet technology investment?

Tony Chan Carusone, Chief Technology Officer from Alphawave Semi, explains:

• AI is the primary driver, enabled by mature die-to-die interface technologies that allow multiple chiplets to function as one large chip
• High-performance compute chiplets require high bandwidth density and low latency interfaces to effectively communicate between dies
• IO and optical chiplets are crucial for scaling AI clusters to thousands of elements, enabling connectivity across vast distances