Use Cases for Chiplets in AI Clusters
What's driving the surge in chiplet technology investment?
Tony Chan Carusone, Chief Technology Officer from Alphawave Semi, explains:
- AI is the primary driver, enabled by mature die-to-die interface technologies that allow multiple chiplets to function as one large chip
- High-performance compute chiplets require high bandwidth density and low latency interfaces to effectively communicate between dies
- IO and optical chiplets are crucial for scaling AI clusters to thousands of elements, enabling connectivity across vast distances
Related Chiplet
- FlexGen Multi-Die Smart Network-on-Chip (NoC) IP
- Ncore Multi-Die Interconnect IP
- Integrated voltage regulator (IVR) chiplet
- High-performance connectivity chiplets
- eFPGA Chiplet
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