The future of AI: Chiplets & Lasers
One of the limits of how big AI scales in the future is how fast the hardware can talk to each other. Ayar Labs, a silicon valley based startup, has an in-package optical interconnect solution, involving optics-in-silicon for faster chip-to-chip connectivity. Ian Cutress spoke with CEO Mark Wade about the technology, the roll-out, and what it all means!
Related Chiplet
- Integrated voltage regulator (IVR) chiplet
- High-performance connectivity chiplets
- eFPGA Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
Related Videos
- Chiplets for the future of AI
- Podcast: AI, Chiplets, and the Future of Semiconductors
- Embedded World, Nuremberg: Arm’s Suraj Gajendra on AI, Chiplets, and the Future of Automotive Compute
- Scaling Open Compute: RISC-V, Chiplets, and the Future of AI and Robotics
Latest Videos
- The Future of 3D Heterogeneous Integration (3DHI)
- Stop Guessing on Multi-Die PG Planning: Let AI Find the IR-Drop Sweet Spot
- Arm's Dong Wei on Why Firmware Will Define the Chiplet Ecosystem
- What's New in UALink? Technical Deep Dive into the Latest UALink Specifications
- 2026 DRAM and Advanced Packaging Master Class