The Siemens SIPI approach: From feasibility to final closure in 3D IC design
How do you ensure clean, stable power and reliable signal transmission in a dense 3D IC stack without introducing late-stage surprises?
In this episode of the Siemens 3D IC Podcast, host John McMillan sits down with John Caka, Principal SIPI Engineer at Siemens EDA, to explore why signal integrity and power integrity (SIPI) analysis are more vital than ever in 3D IC workflows and why progressive verification is key to managing complexity at every stage of design.
Together, they unpack the evolving demands of SIPI in 3D IC architecture, from early planning to vendor-specific IP verification. You'll learn how multidisciplinary teams—spanning layout, thermal, mechanical, electrical, and packaging—must align in parallel to make next-gen designs successful.
This episode also shares behind-the-scenes insight into Siemens' recent collaboration with Chiplets, highlighting the EDA tool flexibility and scalability needed for today's massive pin-count designs.
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