From OCP 2025: Arm’s Chiplet Push and the AI Ecosystem Play
At OCP Global Summit 2025 in San Jose, Allyson Klein and Jeniece Wnorowski talk with Arm’s Eddie Ramirez about the rapid expansion of Arm Total Design, Arm’s FCSA chiplet spec contribution to the OCP community, Arm’s new OCP board seat, and why an ecosystem view—from SSDs to servers—matters for AI at scale.
Chapters
- Welcome, hosts, and setting the stage
- AI everywhere: why heterogeneous silicon wins
- Arm Total Design update and partner momentum
- OCP announcements this week
- Arm joins the OCP Board
- FCSA chiplet spec contribution and interop goals
- Democratizing AI compute and what’s next
Related Chiplet
- FlexGen Multi-Die Smart Network-on-Chip (NoC) IP
- Ncore Multi-Die Interconnect IP
- Integrated voltage regulator (IVR) chiplet
- High-performance connectivity chiplets
- eFPGA Chiplet
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- Chiplet interoperability and breakthroughs in AI
- Synopsys Keynote at Chiplet Summit 2025: Accelerating AI Chip Development with 3D Multi-Die Designs
- Imec Automotive Chiplet Forum 2025: Interview with Arm's John Kourentis
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