TYLsemi De-Risks Chiplets With New Business Model

By Sally Ward-Foxton, EE Times | July 15, 2026

With a fresh $43 million in seed funding, TYLsemi has developed a new type of fabless semiconductor business model: the startup wants to de-risk AI infrastructure builders’ big chiplet-based designs by handling everything around their compute chiplets, including surrounding chiplets, packaging, and test.

Nobody owns such a chiplet platform today, TYLsemi cofounder and CEO Mohit Gupta told EE Times, since the custom silicon market is simultaneously polarized and fragmented.  

“Companies like Broadcom and Marvell have the ability to do the entire thing, but they position themselves as all or nothing engagements, and they are focused on opportunities that yield billions of dollars a year in revenue,” Gupta said. “On the other side you have a mix of IP and services companies […] where it’s fragmented and you have to work with a bunch of companies and you are carrying the risk, because nobody’s holding that risk for you.”

Responding to geopolitical and supply chain factors, AI frontier labs and hyperscalers are going vertical, building silicon in-house for their own needs.

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