Cu-Cu Hybrid Bonding for Chiplets Heterogeneous Integration
By John H Lau
Unimicron Technology Corporation
Abstract
Cu-Cu hybrid bonding is an old packaging technology. It has been in high volume manufacturing (HVM) for more than 10 years. In this study, HVM or to be in HVM products and potential new products with Cu-Cu hybrid bonding will be briefly mentioned. Some recommendations will be provided. A brief history and fundamentals of Cu-Cu hybrid bonding will be presented first.
Keywords: Cu-Cu hybrid bonding, HVM products with hybrid bonding, new applications with hybrid bonding
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