Chiplets for Automotive – Are We There Yet?
By Nir Sever, Sr. Director, Business Development, proteanTecs
For decades, Automotive Electronics were based on semiconductors manufactured on mature and stable process technologies. Designs were well characterized for robustness; tight screening at the production line enforced quality; using industry-standard test methodologies such as JEDEC JESD22 and JESD47 [1] assured reliability. Functional Safety (FuSa) relies on monitoring software, system redundancy, and safety protocols. Today, Electric Vehicles (EV) and Autonomous Driving (ADAS) require using the most advanced semiconductor technologies. Reliability requirements exceed those commonly used for commercial applications, device screening becomes a challenge, and safety measures that take effect after an error has already occurred may be insufficient.
Recently, chipletbased designs are driving the most advanced semiconductors for High-Performance Computing (HPC) and AI. Is chiplet-based design ready to be adopted by the Automotive industry?
To read the full article, click here
Related Chiplet
- Interconnect Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
Related Technical Papers
- Chiplets Are The New Baseline for AI Inference Chips
- Advanced Packaging and Chiplets Can Be for Everyone
- Efficient ESD Verification For 2.5/3D Automotive ICs
- Workflows for tackling heterogeneous integration of chiplets for 2.5D/3D semiconductor packaging
Latest Technical Papers
- Chiplet-Based RISC-V SoC with Modular AI Acceleration
- Near-energy-free photonic Fourier transformation for convolution operation acceleration
- Optimizing Inter-chip Coupler Link Placement for Modular and Chiplet Quantum Systems
- Material Needs and Measurement Challenges for Advanced Semiconductor Packaging: Understanding the Soft Side of Science
- Leveraging 3D Technologies for Hardware Security: Opportunities and Challenges