Challenges and Opportunities to Enable Large-Scale Computing via Heterogeneous Chiplets
Fast-evolving artificial intelligence (AI) algorithms such as large language models have been driving the ever-increasing computing demands in today's data centers. Heterogeneous computing with domain-specific architectures (DSAs) brings many opportunities when scaling up and scaling out the computing system. In particular, heterogeneous chiplet architecture is favored to keep scaling up and scaling out the system as well as to reduce the design complexity and the cost stemming from the traditional monolithic chip design. However, how to interconnect computing resources and orchestrate heterogeneous chiplets is the key to success. In this paper, we first discuss the diversity and evolving demands of different AI workloads. We discuss how chiplet brings better cost efficiency and shorter time to market. Then we discuss the challenges in establishing chiplet interface standards, packaging, and security issues. We further discuss the software programming challenges in chiplet systems.
To read the full article, click here
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related Technical Papers
- Tiny Chiplets Enabled by Packaging Scaling: Opportunities in ESD Protection and Signal Integrity
- NoCs and the transition to multi-die systems using chiplets
- Small Dies, Big Dreams: Challenges and Opportunities in Chiplet Commoditization
- Leveraging 3D Technologies for Hardware Security: Opportunities and Challenges
Latest Technical Papers
- Mozart: Modularized and Efficient MoE Training on 3.5D Wafer-Scale Chiplet Architectures
- Network Design for Wafer-Scale Systems with Wafer-on-Wafer Hybrid Bonding
- CarbonPATH: Carbon-aware pathfinding and architecture optimization for chiplet-based AI systems
- RPU -- A Reasoning Processing Unit
- Spatiotemporal thermal characterization for 3D stacked chiplet systems based on transient thermal simulation