The hidden heat challenge of 3D IC: and what designers need to know
Why is thermal analysis no longer an afterthought in 3D IC design—and what is Siemens doing to empower engineers across every step of the process?
In this episode of the Siemens EDA Podcast Series on 3D IC chiplet ecosystems, host John McMillan welcomes András Vass-Varnai, 3DIC Solutions Engineer at Siemens Digital Industries, to spotlight one of the most critical (and often underestimated) challenges in modern chip design: thermal analysis.
As power densities soar and chiplets stack closer together than ever before, effective thermal management is essential—not just for performance, but for reliability, lifespan, and product feasibility. András explores how Siemens is bridging the gap between design, packaging, and thermal engineering through integrated toolchains and a new generation of digital twins.
Whether you're a silicon designer, package architect, or thermal analyst, this episode offers valuable insights into the future of collaborative thermal modeling, IP protection, and real-time simulation integration.
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