Revolutionizing AI & Chiplets: Baya Systems CEO on $36M Series B, UALink, Future of Data Movement
AI computing is evolving, and the biggest challenge is no longer compute power—it’s data movement and connectivity. In this exclusive interview, Dr. Sailesh Kumar, CEO of Baya Systems, sits down with Sanjay Gangal from EDACafe to discuss:
- Baya’s $36M+ Series B funding and expansion plans
- The rise of chiplet architectures and the importance of standards like UALink and UCIe
- WeaverPro™ and WeaveIP™ – Baya’s software-driven approach to solving AI’s biggest bottleneck
- Why data movement is the key challenge in AI and high-performance computing
- Strategic partnerships with Synopsys, Intel Capital, and Tenstorrent
- The future of modular, high-performance semiconductor design
With a team of industry veterans from Apple, AMD, Arm, Intel, and Qualcomm, and Jim Keller as Chairman of the Board, Baya Systems is set to redefine the semiconductor landscape.
Related Videos
- Podcast: AI, Chiplets, and the Future of Semiconductors
- Revolutionizing System Design: Impact of Chiplets and Heterogeneous Integration on AI Server
- Impact of Chiplets, Heterogeneous Integration and Modularity on AI and HPC systems
- Baya Systems AI-optimized chiplet interconnects at Embedded World 2025 WeaverPro, WeaveIP RISC-V HPC
Latest Videos
- Revolutionizing SoC Design: The Shift to Chiplet-Based Architectures
- Embedded World, Nuremberg: Arm’s Suraj Gajendra on AI, Chiplets, and the Future of Automotive Compute
- Keysight Expands Chiplet Interconnect Support with UCIe 2.0 & BoW
- Revolutionizing AI & Chiplets: Baya Systems CEO on $36M Series B, UALink, Future of Data Movement
- Machine Learning Applications in EDA for Chiplet Reliability