Podcast - A Modular Future: Chiplets, AI, and Advanced Packaging
On this episode of Embedded Insiders, Ken sits down with Rozalia Beica, Field CTO at Rapidus Corporation, to explore the rise of chiplet integration, Rapidus' U.S. expansion, the transformative role of AI in semiconductors, and the growing importance of advanced packaging in the industry. Stay tuned for insights into how Rapidus is shaping the future of semiconductor technology.
Next, Ken discusses how customer experience centers are driving innovation in complex embedded systems.
But first, Rich and Ken highlight some important industry news involving, you guessed it, AI. They’re also sharing some information ahead of embedded world 2025.
To watch the video, click here
Related Videos
- Podcast: AI, Chiplets, and the Future of Semiconductors
- "Automotive AI: ADAS, Functional Safety and Chiplets" AI with Sally - New Tech Podcast
- Embedded World, Nuremberg: Arm’s Suraj Gajendra on AI, Chiplets, and the Future of Automotive Compute
- Impact of Chiplets, Heterogeneous Integration and Modularity on AI and HPC systems
Latest Videos
- Revolutionizing SoC Design: The Shift to Chiplet-Based Architectures
- Embedded World, Nuremberg: Arm’s Suraj Gajendra on AI, Chiplets, and the Future of Automotive Compute
- Keysight Expands Chiplet Interconnect Support with UCIe 2.0 & BoW
- Revolutionizing AI & Chiplets: Baya Systems CEO on $36M Series B, UALink, Future of Data Movement
- Machine Learning Applications in EDA for Chiplet Reliability