Podcast - A Modular Future: Chiplets, AI, and Advanced Packaging
On this episode of Embedded Insiders, Ken sits down with Rozalia Beica, Field CTO at Rapidus Corporation, to explore the rise of chiplet integration, Rapidus' U.S. expansion, the transformative role of AI in semiconductors, and the growing importance of advanced packaging in the industry. Stay tuned for insights into how Rapidus is shaping the future of semiconductor technology.
Next, Ken discusses how customer experience centers are driving innovation in complex embedded systems.
But first, Rich and Ken highlight some important industry news involving, you guessed it, AI. They’re also sharing some information ahead of embedded world 2025.
To watch the video, click here
Related Chiplet
- Interconnect Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
Related Videos
- Podcast: AI, Chiplets, and the Future of Semiconductors
- "Automotive AI: ADAS, Functional Safety and Chiplets" AI with Sally - New Tech Podcast
- Embedded World, Nuremberg: Arm’s Suraj Gajendra on AI, Chiplets, and the Future of Automotive Compute
- Scaling Open Compute: RISC-V, Chiplets, and the Future of AI and Robotics
Latest Videos
- DreamBig Semiconductor's Journey From Seed to Series B Funding for Their Multi-Die AI Chiplet
- Scaling a chiplet-based quantum processor toward fault-tolerance
- Splitting the Die A Modular Approach to Chiplet Design and Verification
- OCE Transaction and Link Layer Specification 1.2 Update
- Tools for Testing Chiplet-based Designs