Optical Connectivity At 224 Gbps
By Mike Klempa, Alphawave Semi
AI is generating so much traffic that traditional copper-based approaches for moving data inside a chip, between chips, and between systems, are running out of steam. Just adding more channels is no longer viable. It requires more power to drive signals, and the distance those signals can travel without excessive loss is shrinking. Mike Klempa, product marketing specialist at Alphawave Semi, talks with Semiconductor Engineering about the impact of linear pluggable optics (LPOs) and linear retimed optics (LROs), which increase the reach of signals with significantly less power, but at the price of higher complexity.
Related Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Interconnect Chiplet
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
Related Videos
- Photonic Fabric Interface Chiplets for AI XPU Optical Connectivity
- Intel's Optical I/O Chiplet Co-Packaged with Server CPU
- Moving Data at the Speed of AI
- Live with Cadence talking AI, Chiplets, Virtual Prototyping and more at Embedded World 2024
Latest Videos
- Optical Connectivity At 224 Gbps
- Proximity is all You Need – Two Tricks for Chiplet Interconnects
- 3D IC Podcast | The future of 3D ICs: How advanced packaging is changing the industry
- Mick Posner talks about the importance of UCIe
- Optimizing Chiplet architectures of RISC-V clusters, GPU and DNN using System-Level IP