Packaging the Future of Semiconductors: Lim Choon Khoon on Chiplets, HBM, and Beyond
In this episode, Salah Nasri sits down with Lim Choon Khoon, CEO Advanced Packaging Business Business Group, Semiconductor Solutions at ASMPT to dive into the future of semiconductor packaging and assembly equipment.
- How ASMPT is driving innovation in chiplets, HBM, and advanced packaging
- Leadership lessons from CK Lim’s journey in one of the most competitive industries on earth
- The critical role packaging plays in enabling the next era of semiconductor performance
Related Chiplet
- Interconnect Chiplet
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- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
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