Enabling a true open ecosystem for 3D IC design

By Anthony Mastroianni (Siemens EDA - Advanced Packaging Solutions Director)

Heterogeneous integration itself isn't new- but new design and manufacturing technologies- combined with new product demands from system integrators- means that heterogeneous integration and 3D IC are now becoming a necessity in mainstream design. This shift however is not without its challenges as 3D IC is not a simple extension of existing packaging solutions but creates a whole new set of multiphysics integration considerations. The interaction of thermal- mechanical- reliability- test- and core semiconductor design increases complexity and requires disparate domains to seemly collaborate. These challenges also require a new set of design enablement kits to support the heterogeneous supply chain in this new 3D IC codesign process.

In this presentation we will discuss the OCP 3D IC Design Kits (3DK) initiatives that support these new design enablement kits to enable a true open ecosystem for 3D IC design.