On the road to automotive chiplets
By Kurt Herremans (Program Director Automotive) - Imec
Electrified- software defined autonomous vehicles offering an immersive digital experience require fast growth of the in-vehicle compute capabilities. The required compute scales beyond a single SoC capability- a problem other markets have also been facing and are solving by moving to chiplets and advanced packaging. Automotive has its specific set of environmental and functional requirements these future chiplet based designs need to address. Imec has been rallying the automotive supply chain to come together on these challenges through our ACA initiative and through collaborative research in our ACP program. During this talk we will discuss the challenges involved with chiplets and how imec sees a path forward.
Related Chiplet
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
- HBM3e Advanced-packaging chiplet for all workloads
- UCIe AP based 8-bit 170-Gsps Chiplet Transceiver
Related Videos
- "Automotive AI: ADAS, Functional Safety and Chiplets" AI with Sally - New Tech Podcast
- Electronica 2024 - Shaping the Future of Automotive Electronics with Chiplets and Sustainability
- Chiplets Extend Automotive SoC AI and GPU Capability
- Embedded World, Nuremberg: Arm’s Suraj Gajendra on AI, Chiplets, and the Future of Automotive Compute
Latest Videos
- Mick Posner talks about the importance of UCIe
- Optimizing Chiplet architectures of RISC-V clusters, GPU and DNN using System-Level IP
- Speeding Up Die-To-Die Interconnectivity
- GENIOEVO™ – Architectural Exploration and Connectivity Management in Advanced Packaging
- Enabling a true open ecosystem for 3D IC design