Marvell Eyeing Connectivity as the Next Big Thing in AI
By Majeed Ahmad, EE Times | December 11, 2025

At this year’s Marvell Industry Analyst Day, held on Dec. 9, Marvell Technology’s President and chief operating officer Chris Koopmans called the company an end-to-end connectivity company. That underscores how connectivity is rapidly emerging as the next big thing in the AI bandwagon.
In his opening address, Koopmans said that the industry has entered an era where the primary bottleneck is no longer compute capacity but connectivity. Why? Because AI compute is now abundant; moreover, modern AI workloads must be partitioned across many processors. As a result, high-speed I/O, SerDes, die-to-die links, memory attach and optical interconnects become essential to overall system performance.
To read the full article, click here
Related Chiplet
- Integrated voltage regulator (IVR) chiplet
- High-performance connectivity chiplets
- eFPGA Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
Related News
- Marvell to Acquire Celestial AI, Accelerating Scale-up Connectivity for Next-Generation Data Centers
- Alphawave Semi Taped-Out Industry Leading 64Gbps UCIe™ IP on TSMC 3nm for the IP Ecosystem, Unleashing Next Generation of AI Chiplet Connectivity
- AI Demand Reshapes Optical Connectivity and Photonics Roadmaps
- Marvell Completes Acquisition of Celestial AI
Latest News
- Amkor Technology Announces Strategic Partnership with NVIDIA to Expand Advanced Packaging and Test for Next-Generation AI Infrastructure
- Synopsys Enables AMD Instinct™ MI455X GPU Design with Comprehensive Multi-Die Solution
- AI Data Centers Push Silicon Photonics Toward 300-mm Scale
- TYLsemi De-Risks Chiplets With New Business Model
- Cadence Introduces AuraStack AI Super Agent, the World’s First Agentic AI Platform for PCB and Advanced Packaging