Where co-packaged optics (CPO) technology stands in 2026
By Majeed Ahmad, EDN | December 30, 2025

Co-packaged optics (CPO) technology, a key enabler for next-generation data center architectures, promises unprecedented bandwidth density and power efficiency by tightly integrating optical engines with switch silicon. But after nearly a decade of existence, where does this next-generation optical interconnect technology stand in terms of broad commercial realization?
But before we delve into CPO’s technology roadmap and its future deployment prospects, here is a brief introduction to this silicon photonics architecture and how it empowers artificial intelligence (AI), high-performance computing (HPC), and high-speed networking applications where electrical signaling over copper wires is reaching its limits.
To read the full article, click here
Related Chiplet
- Integrated voltage regulator (IVR) chiplet
- High-performance connectivity chiplets
- eFPGA Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
Related News
- OFC 2025: Scintil Photonics showcases LEAF Light™, world’s first single-chip, multi-wavelength laser source for DWDM co-packaged optics in AI datacenters
- Intel’s Expanding IP Portfolio in Co-Packaged Optics
- Lightmatter and GUC Partner to Produce Co-Packaged Optics (CPO) Solutions for AI Hyperscalers
- Lightmatter Announces Reference Architecture Initiative with Industry Leaders in the Open Compute Project for Co-Packaged Optics
Latest News
- Mercedes Spinout Athos Closes Its Doors
- NcodiN Appoints Semiconductor Industry Veteran Kiran Burli as Chief Operations Officer
- EV Group Addresses Critical Manufacturing Challenges for Next-Generation Co-Packaged Optics
- SK hynix Holds Groundbreaking Ceremony for HBM Production Base in Indiana, “Beginning a New Future for US-Korea AI”
- Credo Joins Open CPX MSA Organization