Where co-packaged optics (CPO) technology stands in 2026
By Majeed Ahmad, EDN | December 30, 2025

Co-packaged optics (CPO) technology, a key enabler for next-generation data center architectures, promises unprecedented bandwidth density and power efficiency by tightly integrating optical engines with switch silicon. But after nearly a decade of existence, where does this next-generation optical interconnect technology stand in terms of broad commercial realization?
But before we delve into CPO’s technology roadmap and its future deployment prospects, here is a brief introduction to this silicon photonics architecture and how it empowers artificial intelligence (AI), high-performance computing (HPC), and high-speed networking applications where electrical signaling over copper wires is reaching its limits.
To read the full article, click here
Related Chiplet
- FlexGen Multi-Die Smart Network-on-Chip (NoC) IP
- Ncore Multi-Die Interconnect IP
- Integrated voltage regulator (IVR) chiplet
- High-performance connectivity chiplets
- eFPGA Chiplet
Related News
- OFC 2025: Scintil Photonics showcases LEAF Light™, world’s first single-chip, multi-wavelength laser source for DWDM co-packaged optics in AI datacenters
- Intel’s Expanding IP Portfolio in Co-Packaged Optics
- Lightmatter and GUC Partner to Produce Co-Packaged Optics (CPO) Solutions for AI Hyperscalers
- Lightmatter Announces Reference Architecture Initiative with Industry Leaders in the Open Compute Project for Co-Packaged Optics
Latest News
- EdgeCortix Unveils RAIDEN, a Scalable, Energy-Efficient AI Chiplet Platform Purpose-Built for Physical AI
- Coherent Launches PhotonLink™ Integrated Optics Platform for AI Infrastructure
- AT&S and Marvell Technology expand collaboration to support next-generation AI infrastructure
- SMART Photonics Partners with GlobalFoundries to Offer Industry’s First Open Access Foundry Service for Integrated Silicon and Indium Phosphide Photonics Products
- OpenLight Adds Former GlobalFoundries Silicon Photonics Leader Kevin Soukup and Semiconductor Veteran Kirk Ouellette to Executive Team