EMIB

EMIB stands for Embedded Multi-die Interconnect Bridge. It is a packaging technology developed by Intel to connect multiple chips (dies) inside a single package using a small silicon bridge embedded in the substrate.

Key points about EMIB:

• High-bandwidth chip-to-chip communication: It allows very fast data transfer between dies without requiring a large interposer (as in 2.5D packaging).

• Lower cost & simpler manufacturing than full silicon interposers.

• Heterogeneous integration: Different types of chips (CPU, GPU, memory, ASICs) can be connected even if they are made with different process technologies.

• Used in certain Intel products (e.g., FPGA packages, some client and data-center processors).

In simple terms:

EMIB is like a tiny “bridge” inside a chip package that lets different chip pieces talk to each other very quickly and efficiently.