The State of Multi-Die: Insights and Customer Requirements
In this episode, we look at the changing landscape of multi-die design, highlighting how the industry is addressing current challenges and opportunities. We share customer perspectives on essential requirements, including design considerations, scalability, performance and integration, while outlining the current state of multi-die design and the elements shaping future developments. Discover how companies are responding to these demands and gain insights into the future of multi-die design.
Guest: Shekhar Kapoor, Synopsys
Related Chiplet
- Optical Chiplet
- Reverse Gearbox Chiplet
- FlexGen Multi-Die Smart Network-on-Chip (NoC) IP
- Ncore Multi-Die Interconnect IP
- Integrated voltage regulator (IVR) chiplet
Related Videos
- TSMC 3Dblox™: Unleashing 3D IC Innovations for the Next Generation of AI, HPC, Mobile and IoT
- Exploring the Advancement of Chiplet Technology and the Ecosystem
- Surface codes and modular chiplets in the presence of defects
- Exploring the Advancement of Chiplet Technology and the Ecosystem
Latest Videos
- The European Chip Ecosystem
- Scaling up AI Compute, Memory and Connectivity
- CURIE: A Cycle-Accurate and Synthesizable UCIe Interface for the Agile Design and Co-Simulation of Chiplets
- Federated Chiplet Design and Simulation
- Custom HBM as a System: Co-designing the Base Die, Die to Die Power, and Package Thermals for AI Accelerators