The Architecture of "Open" Intelligence
In this episode of TechThreads: Weaving the Intelligent Future, legendary chip architect Jim Keller joins Nandan Nayampally, Baya Systems’ Chief Commercial Officer, to explore how openness, modularity, and simplicity are redefining the architecture of intelligence.
From his early work on Apple’s A4 through A7 processors to today’s AI-driven computing revolution, Jim shares how every leap in performance has come from breaking complexity down into composable, modular layers. Referencing The Systems Bible, he explains why “you can’t fix broken complicated systems”, and why the only path forward is to design simpler components that can scale and evolve together.
The conversation spans:
- The AI paradigm shift. Why traditional compute models no longer scale.
- How data movement, not just compute, has become the new frontier.
- The rise of chiplets and software-driven fabrics for scalable design.
- The power of open ecosystems like RISC-V and OCA to democratize AI innovation.
- Building a path toward sovereign and collaborative compute platforms worldwide.
Listen as Jim Keller unpacks the engineering philosophy behind building open, intelligent systems and what it means for the future of AI and computing at scale.
Related Chiplet
- Optical Chiplet
- Reverse Gearbox Chiplet
- FlexGen Multi-Die Smart Network-on-Chip (NoC) IP
- Ncore Multi-Die Interconnect IP
- Integrated voltage regulator (IVR) chiplet
Related Videos
- The UCIe 1.1 Specification: Our Journey Toward Building an Open Ecosystem of Chiplets
- Scaling Open Compute: RISC-V, Chiplets, and the Future of AI and Robotics
- Securing the Open Chiplet Ecosystem Defining a Common Security Architecture for FCSA
- The Rise of the Chiplet
Latest Videos
- The European Chip Ecosystem
- Scaling up AI Compute, Memory and Connectivity
- CURIE: A Cycle-Accurate and Synthesizable UCIe Interface for the Agile Design and Co-Simulation of Chiplets
- Federated Chiplet Design and Simulation
- Custom HBM as a System: Co-designing the Base Die, Die to Die Power, and Package Thermals for AI Accelerators