System level standards for Multi vendor chiplet interoperability

Itai Nadler, CEO, GSOC LTD
Rob Pelt, Fellow, AMD

The chiplet revolution is well underway, yet composing systems from chiplets across multiple vendors remains largely unsolved. Physical interface standards like UCIe and BoW are necessary, but address only one layer of a much deeper challenge. 

Without system-level standards covering management, software abstraction, and security, every multi-vendor integration remains a custom effort - expensive and slow.

This session presents the progress of the OCP OCE Chiplet Systems working group in defining the full system stack for chiplet interoperability from high-level software abstraction down to the precise API structure and messages exchanged across the chiplet fabric. We cover the Chiplet Management Protocol - built on SCMI principles, extended for cross-die routing and security - and a layered model mapping services such as power and RAS to transport mechanisms and physical interfaces.