OCP Summit 2025: Eddie Ramirez, Arm on Leveraging Chiplets For AI Infra
At the OCP Summit 2025 in San Jose, CA, USA, Arm opened the keynote talks on day 2 of the conference and trade show, and announced some of its news around the AI data center space. This includes Arm's appointment on the board of directors at OCP with other new members from AMD and Nvidia, plus Arm's contribution of its foundation chiplet system architecture (FCSA) specification to the Open Compute Project (OCP).
To find out more about all of this, EE Times' Editor-in-Chief Nitin Dahad spoke to Eddie Ramirez, VP of the infrastructure business at Arm, to find out more about all the developments.
Related Chiplet
- Optical Chiplet
- Reverse Gearbox Chiplet
- FlexGen Multi-Die Smart Network-on-Chip (NoC) IP
- Ncore Multi-Die Interconnect IP
- Integrated voltage regulator (IVR) chiplet
Related Videos
- Embedded World, Nuremberg: Arm’s Suraj Gajendra on AI, Chiplets, and the Future of Automotive Compute
- From OCP 2025: Arm’s Chiplet Push and the AI Ecosystem Play
- Rearchitecting AI Infrastructure with General Purpose and Accelerator Chiplets
- Live with Cadence talking AI, Chiplets, Virtual Prototyping and more at Embedded World 2024
Latest Videos
- Agile Silicon Will Open Chiplet Architectures Keep Pace with Fast-Evolving AI Dataflows
- One Abstraction, Many Transports: Push-Mode Communication from Chiplet to Rack
- Advancing Chiplet Flexibility Updates in 2.0 OCE Transaction and Link Layer Specification
- GTC '26 - Berlin | Long-running, multi-tool Fuse Agents for 3D IC workflows
- Securing the Open Chiplet Ecosystem Defining a Common Security Architecture for FCSA