Multi-Die Systems Set the Stage for Innovation
Abhijeet Chakraborty, Vice President of Engineering at Synopsys, in his keynote at the 2024 Chiplet Summit, said that last year was an inflection point for multi-die systems. Companies, like Synopsys, are providing the tools to design chiplet-based solutions, which is one of the hotter multi-die packaging approaches now available from various fabs.
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related Videos
- Paving the way for the Chiplet Ecosystem
- TSMC 3Dblox™: Unleashing 3D IC Innovations for the Next Generation of AI, HPC, Mobile and IoT
- From the Shadows to the Spotlight – Probe’s Role in Enabling Electronics Industry Innovation
- DreamBig Semiconductor's Journey From Seed to Series B Funding for Their Multi-Die AI Chiplet
Latest Videos
- Inside the AI Bottleneck: Data Movement, Chiplets, and System Scaling
- On-Package Chiplet Innovations with UCIe
- Advanced Semiconductor Packaging Explained: Hybrid Bonding, Chiplets & Manufacturing Innovation
- The Chiplet Market Today and Where It's Headed
- Advanced Packaging & Chiplet Design with Chipletz