MSquare Technology: Enabling Packaging and Interconnect Chiplet IP
In this video interview, EE Times sits down with Sean Wang, one of the co-founders and a VP for MSquare Technology, to discuss the background of the young company, first established in 2021, which he says was a result of a lack of choices for interconnect IP geared toward high speed interfaces in China.
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related Videos
- Exploring the Advancement of Chiplet Technology and the Ecosystem
- Exploring the Advancement of Chiplet Technology and the Ecosystem
- Tutorial: Introduction to Chiplet Interconnect Test and Repair
- Blue Cheetah BlueLynx for Heterogeneous Integration: 16 Gbps Chiplet Interconnect IP for UCIe & BoW
Latest Videos
- Standardizing System-Level Interoperability for Multi-Vendor Chiplets
- Towards wafer-scale optical interconnect relying on Silicon Photonics and advanced 3D assembly
- Pre-Silicon Chiplet Verification for Datacenters
- Chiplets Modularity for AI and HPC
- Athos Silicon mSoC™ | A New Compute Architecture for Physical AI