Intel Foundry: Connecting Customers and Chiplets
At the Six Five Summit: AI Unleashed, we're ecstatic to feature Kevin O’Buckley, SVP and GM, Foundry Services, Intel, as one of our Semiconductors track speakers. He joins host Patrick Moorhead for a deep dive into how Intel Foundry is revolutionizing semiconductor design and manufacturing through advanced chiplet-based designs and packaging.
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related Videos
- IBM Research: Benefits and challenges of Chiplets
- Chiplet Architecture Accelerates Delivery of Industry-Leading Intel® FPGA Features and Capabilities
- Getting Moore with Less: How Chiplets and Open Interconnect Accelerate Cloud-Optimized AI Silicon
- Chiplets and Next-gen Packaging Technologies in University Education
Latest Videos
- The Evolution Of UCIe
- Blueprint for AI Hardware But with Instructions: Pre-Validated Chiplet Building Blocks
- Standardizing System-Level Interoperability for Multi-Vendor Chiplets
- Towards wafer-scale optical interconnect relying on Silicon Photonics and advanced 3D assembly
- Pre-Silicon Chiplet Verification for Datacenters