From chips to silicon destiny: The next wave of 3D IC
From AI accelerators to automotive silicon, what does it actually take — organizationally, economically, and technically — to make 3D IC work in the real world?
In this episode of the Siemens 3D IC Podcast, closing out the season, host Tova Levy speaks with Piyush Sancheti, VP of Central Engineering Solutions (3D IC) at Siemens EDA, for a full-circle look at where 3D IC adoption stands today.
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