The Future of 3D Heterogeneous Integration (3DHI)

By Madhavan Swaminathan, Penn State University

Moore’s law has helped us for 5+ decades through monolithic integration with packaging taking a back seat. We have now reached a stage in the semiconductor industry where 3D Heterogeneous Integration (3DHI) is taking front seat, with billions of dollars being invested in it. Does this mean the end of Moore’s law? Why is 3DHI so critical for Artificial Intelligence (AI) to succeed? Can 3DHI be used to continue Moore’s law? This talk will address several of these questions along with potential solutions and challenges in the context of emerging applications and systems.

SPEAKER BIO:

Madhavan Swaminathan is the Department Head of Electrical Engineering and is the William E. Leonhard Endowed Chair at Penn State University. He also serves as the Director for the Center for Heterogeneous Integration of Micro Electronic Systems (CHIMES), an SRC JUMP 2.0 Center www.chimes.psu.edu. Prior to joining Penn State, he was the John Pippin Chair in Microsystems Packaging & Electromagnetics in the School of Electrical and Computer Engineering (ECE), Professor in ECE with a joint appointment in the School of Materials Science and Engineering (MSE), and Director of the 3D Systems Packaging Research Center (PRC) – a graduated NSF-Engineering Research Center (ERC), Georgia Tech (GT). Prior to GT, he was with IBM working on packaging for supercomputers. Prof. Swaminathan’s interdisciplinary research on semiconductor packaging and systems integration over the years have resulted in 650+ technical publications, 200+ invited presentations (seminars, keynotes, panels), 3 books, 5 book chapters, 31 patents, 35 best paper and student paper awards, 5 GT awards, 2 start-ups, and several international recognitions with the recent one being the 2024 IEEE Rao R. Tummala Electronics Packaging Award (highest technical field award in packaging) for “contributions to semiconductor packaging and system integration technologies that improve the performance, efficiency, and capabilities of electronic systems”. He is also the founder of the IEEE Conference on Electrical Design of Advanced Packaging and Systems (EDAPS), a premier conference sponsored by the IEEE Electronics Packaging Society (EPS). He is a Fellow of IEEE, Fellow of the National Academy of Inventors (NAI), Fellow of Asia-Pacific Artificial Intelligence Association (AAIA), and has served as the Distinguished Lecturer for the IEEE Electromagnetic Compatibility (EMC) society. He serves as an advisor to India Semiconductor Mission and on the external advisory board for Move2THz (an EU initiative), as well as advisor to 3DGS and Claros. He received his MS and PhD degrees in Electrical Engineering from Syracuse University, USA.