Bapiraju Vinnakota: Chiplets Ecosystem
On October 18, 2024, the U.S. Department of Commerce issued a Notice of Funding Opportunity (NOFO) to enable the United States semiconductor industry to adopt innovative new advanced packaging flows for semiconductor technologies. CHIPS for America anticipates making available up to approximately $1.6 billion for funding multiple awards across five research and development (R&D) areas, with the potential for follow-on funding for prototyping activities. Watch this informational video to learn more about Chiplets Ecosystem.
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