Understanding In-Package Optical I/O Versus Co-Packaged Optics
By Vladimir Stojanovic, Ayar Labs
Though the two terms above are often compared, one is a replacement strategy for pluggables while the other is a chiplet-based optical interconnect solution. A closer look at both will help clarify.
Recent advancements in silicon photonics are upending the optical market in the data center, with significant ramifications for how future AI, cloud, and high-performance computing systems will be designed, architected, and deployed. The core problem involves how to best connect compute chips over longer distances while maintaining bandwidth, energy, and density metrics that are acceptable for a given application.
At the same time, there is a lot of confusion — some inadvertent, some perhaps intentionally sown — regarding the differences between interconnect technologies such as co-packaged optics (CPOs), pluggables, and in-package optical I/O. Moreover, various industry standards are in play for these optical connections: What do they portend for the future?
To read the full article, click here
Related Chiplet
- 100G optical I/O chiplets
- Reconfigurable 112G SerDes IO with integrated protocol controllers, security IP and UCIe PHY and Controller IP
Related Technical Papers
- Understanding In-Package Optical I/O Versus Co-Packaged Optics
- Interfacing silicon photonics for high-density co-packaged optics
- Low-Loss Integration of High-Density Polymer Waveguides with Silicon Photonics for Co-Packaged Optics
- Scaling Routers with In-Package Optics and High-Bandwidth Memories
Latest Technical Papers
- Link Quality Aware Pathfinding for Chiplet Interconnects
- Effects of Poor Workload Partitioning on System Performance for Chiplet-Based Systems
- Mozart: Modularized and Efficient MoE Training on 3.5D Wafer-Scale Chiplet Architectures
- Network Design for Wafer-Scale Systems with Wafer-on-Wafer Hybrid Bonding
- CarbonPATH: Carbon-aware pathfinding and architecture optimization for chiplet-based AI systems