Taming the Tail: NoI Topology Synthesis for Mixed DL Workloads on Chiplet-Based Accelerators
By Arnav Shukla 1, Harsh Sharma 2, Srikant Bharadwaj 3, Vinayak Abrol 1, Sujay Deb 1
1 Indraprastha Institute of Information Technology Delhi, New Delhi, India
2 Washington State University, Pullman, Washington, USA
3 Microsoft Research, Redmond, Washington, USA

Abstract
Heterogeneous chiplet-based systems improve scaling by disaggregating CPUs/GPUs and emerging technologies (HBM/DRAM). However this on-package disaggregation introduces a latency in Network-on-Interposer (NoI). We observe that in modern large model inference, parameters and activations routinely move back and forth from HBM/DRAM, injecting large, bursty flows into the interposer. These memory-driven transfers inflate tail latency and violate Service Level Agreements (SLAs) across k-ary n-cube baseline NoI topologies. To address this gap we introduce an Interference Score (IS) that quantifies worst-case slowdown under contention. We then formulate NoI synthesis as a multi-objective optimization (MOO) problem. We develop PARL (Partition-Aware Reinforcement Learner), a topology generator that balances throughput, latency, and power. PARL-generated topologies reduce contention at the memory cut, meet SLAs, and cut worst-case slowdown to 1.2× while maintaining competitive mean throughput relative to linkrich meshes. Overall, this reframes NoI design for heterogeneous chiplet accelerators with workload-aware objectives.
Keywords: network-on-package, chiplets, Mixture-of-Experts, activation sparsity, sparse multicast, energy-efficiency
To read the full article, click here
Related Chiplet
- eFPGA Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
Related Technical Papers
- Multi-Objective Hardware-Mapping Co-Optimisation for Multi-DNN Workloads on Chiplet-based Accelerators
- ThermoDSE: A Thermal-Aware and Comprehensive Design Space Exploration for Chiplet-Based DNN Accelerators
- SCAR: Scheduling Multi-Model AI Workloads on Heterogeneous Multi-Chiplet Module Accelerators
- FoldedHexaTorus: An Inter-Chiplet Interconnect Topology for Chiplet-based Systems using Organic and Glass Substrates
Latest Technical Papers
- HCRMap: Pressure-Aware Hot-Expert Residency Mapping for 3.5D MoE Chiplet Inference
- Chiplet3D: Pin- and Thermal-Aware 3D Chiplet Floorplanning via Convolution-Embedded MILP
- The Signal-Integrity Control Strategy of a TSV Array for a Chiplet-Based System
- ThermoDSE: A Thermal-Aware and Comprehensive Design Space Exploration for Chiplet-Based DNN Accelerators
- GPU-Accelerated Effective Resistance Analysis for 3D IC Power Delivery Network