Simulation-Driven Evaluation of Chiplet-Based Architectures Using VisualSim
By Wajid Ali 1, Ayaz Akram 2, Deepak Shankar 3
1 University of Engineering and Technology, Lahore, Pakistan
2 Samsung, San Jose, USA
3 Mirabilis Design Inc, Santa Clara, USA

Abstract
This paper focuses on the simulation of multi-die System-on-Chip (SoC) architectures using VisualSim, emphasizing chiplet-based system modeling and performance analysis. Chiplet technology presents a promising alternative to traditional monolithic chips, which face increasing challenges in manufacturing costs, power efficiency, and performance scaling. By integrating multiple small modular silicon units into a single package, chiplet-based architectures offer greater flexibility and scalability at a lower overall cost. In this study, we developed a detailed simulation model of a chiplet-based system, incorporating multicore ARM processor clusters interconnected through a ARM CMN600 network-on-chip (NoC) for efficient communication. The simulation framework in VisualSim enables the evaluation of critical system metrics, including inter-chiplet communication latency, memory access efficiency, workload distribution, and the power-performance tradeoff under various workloads. Through simulation-driven insights, this research highlights key factors influencing chiplet system performance and provides a foundation for optimizing future chiplet-based semiconductor designs.
To read the full article, click here
Related Chiplet
- High Performance Droplet
- Interconnect Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Bridglets
- Automotive AI Accelerator
Related Technical Papers
- Thermal Implications of Non-Uniform Power in BSPDN-Enabled 2.5D/3D Chiplet-based Systems-in-Package using Nanosheet Technology
- Chiplet-Based Architectures: Redefining the Future of System-on-Chip (SoC) Design
- Recent Progress in Structural Integrity Evaluation of Microelectronic Packaging Using Scanning Acoustic Microscopy (SAM): A Review
- RapidChiplet: A Toolchain for Rapid Design Space Exploration of Chiplet Architectures
Latest Technical Papers
- Thermo-mechanical co-design of 2.5D flip-chip packages with silicon and glass interposers via finite element analysis and machine learning
- High-Efficient and Fast-Response Thermal Management by Heterogeneous Integration of Diamond on Interposer-Based 2.5D Chiplets
- HexaMesh: Scaling to Hundreds of Chiplets with an Optimized Chiplet Arrangement
- A physics-constrained and data-driven approach for thermal field inversion in chiplet-based packaging
- Probing the Nanoscale Onset of Plasticity in Electroplated Copper for Hybrid Bonding Structures via Multimodal Atomic Force Microscopy