Fast and Accurate Jitter Modeling for Statistical BER Analysis for Chiplet Interconnect and Beyond
By Shenggao Li and Maher Amer (TSMC)

Abstract:
In this paper, we investigate Statistical Bit Error Rate (BER) analysis for low-loss short-reach chiplet interface and high-loss long-reach serial interface. We used jitter filtering to account for the residue jitter not tracked by a forwarded clock system and proposed a fast and exact Statistical BER method to account for the Tx jitter amplification effect in a high-loss channel. Our proposed method achieves a linear computation complexity.
To read the full article, click here
Related Chiplet
- eFPGA Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
Related Technical Papers
- ATSim: A Fast and Accurate Simulation Framework for 2.5D/3D Chiplet Thermal Design Optimization
- 3D-ICE 4.0: Accurate and efficient thermal modeling for 2.5D/3D heterogeneous chiplet systems
- Fault Modeling, Testing, and Repair for Chiplet Interconnects
- CLIPGen: A Chiplet Link IP Modeling and Generation Framework for 2.5D Architecture Exploration
Latest Technical Papers
- The Signal-Integrity Control Strategy of a TSV Array for a Chiplet-Based System
- ThermoDSE: A Thermal-Aware and Comprehensive Design Space Exploration for Chiplet-Based DNN Accelerators
- GPU-Accelerated Effective Resistance Analysis for 3D IC Power Delivery Network
- FAPlace: Joint Optimization of Chiplet Placement and Interposer Footprint for 2.5D Systems
- Chiplet-Escape: An Efficient Obstacle-Avoiding Escape Routing Method for Die-to-Die Interconnections in Chiplet-Based Designs