ChipletQuake: On-die Digital Impedance Sensing for Chiplet and Interposer Verification
Abstract
The increasing complexity and cost of manufacturing monolithic chips have driven the semiconductor industry toward chiplet-based designs, where smaller and modular chiplets are integrated onto a single interposer. While chiplet architectures offer significant advantages, such as improved yields, design flexibility, and cost efficiency, they introduce new security challenges in the horizontal hardware manufacturing supply chain. These challenges include risks of hardware Trojans, cross-die sidechannel and fault injection attacks, probing of chiplet interfaces, and intellectual property theft. To address these concerns, this paper presents ChipletQuake, a novel on-chiplet framework for verifying the physical security and integrity of adjacent chiplets during the post-silicon stage. By sensing the impedance of the power delivery network (PDN) of the system, ChipletQuake detects tamper events in the interposer and neighboring chiplets without requiring any direct signal interface or additional hardware components. Fully compatible with the digital resources of FPGA-based chiplets, this framework demonstrates the ability to identify the insertion of passive and subtle malicious circuits, providing an effective solution to enhance the security of chipletbased systems. To validate our claims, we showcase how our framework detects Hardware Trojan and interposer tampering.
Index Terms — Hardware Security, Hardware Trojans, Power Delivery Network, Tamper Detection, Chiplet Security
To read the full article, click here
Related Chiplet
- Integrated voltage regulator (IVR) chiplet
- High-performance connectivity chiplets
- eFPGA Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
Related Technical Papers
- FAPlace: Joint Optimization of Chiplet Placement and Interposer Footprint for 2.5D Systems
- Optimizing Inter-chip Coupler Link Placement for Modular and Chiplet Quantum Systems
- 3D-ICE 4.0: Accurate and efficient thermal modeling for 2.5D/3D heterogeneous chiplet systems
- Development and Optimization of Fine-Pitch RDL for RDL Interposer, and Embedded Bridge Die Interposer Fabrication Using Fan-Out Wafer-Level Packaging Technology
Latest Technical Papers
- Hardware Trojan Threats to Multi-Chiplet Photonic Neural Network Accelerators
- Mapping Dynamic, Hierarchical Quantum Circuits
- Chiplet-Based Techniques for Scalable and Memory-Aware Multiscalar Multiplication on Hardware Platforms
- A Time-Encoded Analog Photonic Interposer for Energy-Efficient Integration of Analog Vision Sensors and Analog Accelerators
- Self-Activated Direct Bonding with a Highly Polar Atomic-Layer-Deposited Film for 3D Integration