Wooptix Targets AI Packaging Bottleneck with Astronomy Tech

A Canary Islands startup brings wavefront imaging to semiconductor metrology, aiming to tackle wafer shape challenges in 3D integration.

By Pat Brans, EETimes | May 11, 2026

As chipmakers race to build faster AI processors, attention has shifted beyond transistor scaling and toward advanced packaging, hybrid bonding, and 3D integration. That shift is creating new manufacturing bottlenecks—among them, how to precisely measure wafer shape, topography, and warpage as devices become thinner, denser, and increasingly stacked.

One company hoping to capitalize on that transition is Wooptix, a Spain-based startup whose core technology originated not in semiconductor fabs, but in astronomy labs in the Canary Islands.

The company says wavefront-sensing techniques originally developed to correct atmospheric distortion in telescopes can now help semiconductor manufacturers inspect wafers faster and with greater detail than some conventional approaches.

To read the full article, click here