Kenyi Technologies to collaborate with ADTechnology to co-develop a Server Processor targeting Edge AI and Telco use cases

May 8, 2026 -- Kenyi Technologies has signed a strategic MoU agreement with ADTechnology to co-develop an Edge Server Processor solution leveraging chiplet technology. The solution pairs ADTechnology’s 2nm ADP620 ARM Neoverse CPU technology with Kenyi Technologies Edge Server DPU technology. This chiplet pairing will provide an accelerated server compute platform targeting Edge Infrastructure use cases such as telco vRAN and Physical AI Inferencing.

By combining a server grade ARM CPU chiplet with a DPU accelerator chiplet tailored to the Edge, the solution is expected to improve power efficiency and scalability of vRAN Distributed Unit (DU) solutions at cost points commensurate to legacy purpose-built appliances, as well as provide a compelling framework for proximal inferencing offload to Edge Infrastructure in a cost-effective manner.

ADTechnology’s turnkey design services and packaging capabilities along with Kenyi’s experience in designing infrastructure platforms (ex-Qualcomm founding team) will reduce project execution risk and cost.

AD Technology CEO Jun-Kyu Park stated – 

"This collaboration allows us to showcase our ADP620 platform and chiplet interposer design capabilities on a global stage. We are committed to strengthening our strategic partnerships in North America by providing advanced architecture and integrated manufacturing support."

Kenyi Technologies CEO Vincent Loncke stated –

"AD Technology’s proprietary 2-nm HPC CPU platform and expertise in advanced packaging make them the ideal partner to target the next-generation semiconductor market. By combining our core technologies, we will introduce high-performance chiplet solutions that can lead the fast-growing global Telco Server and Edge Computing markets."