The Basics of Chiplet Integration and Importance of Adhesive Solutions
By Jillian Carapella, 3DInCites (September 3, 2024)
What You Need to Know as an Industry Newcomer
If you’re a regular reader of 3D InCites, you’ve probably seen the word “chiplets” before, but you may not know what they are. To put it simply, chiplets are small “chips” that perform singular functions really well, but they can’t perform their designated function on their own. Instead, they are designed to be integrated with other chiplets in a package to perform like a full chip.
For instance, a chiplet may be a processor core, a memory block, or something else, and it needs its companion pieces to work effectively. Because of this, some industry leaders like to compare chiplets to Legos.
Chiplets are becoming an increasingly important part of the advanced packaging conversation. With advancements in artificial intelligence (AI), high performance computing (HPC) and other next-generation technologies, more computing power needs to fit in less space than ever before, and chiplets can help make this possible. So, to learn more about chiplet integration, I spoke with Raj Peddi, director of marketing strategy at Henkel. Henkel is a material supplier for the semiconductor packaging industry.
To read the full article, click here
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related News
- EV Group Hybrid Bonding, Maskless Lithography and Layer Transfer Solutions for Heterogeneous Integration to be Highlighted at ECTC 2024
- EV Group Highlights 3D Integration Process Solutions at SEMICON Taiwan 2024
- DreamBig Semiconductor Announces Partnership with Samsung Foundry to Launch Chiplets for World Leading MARS Chiplet Platform on 4nm FinFET Process Technology Featuring 3D HBM Integration to Solve Scale-up and Scale-out Limitations of AI for the Masses
- Numem Overcomes AI Performance Barriers with Next-Gen Memory Solutions, Highlights Innovations at Chiplet Summit
Latest News
- Tower Semiconductor Signs Customer Contracts for $1.3 Billion Silicon Photonics Revenue for 2027
- IC-Link by imec joins TSMC 3DFabric® Alliance to accelerate advanced packaging and 3D IC innovation
- EXTOLL announces Availability of Industry's first 16G UCIe PHY IP in GlobalFoundries 22FDX/22FDX+ Ready for Customer Integration
- NHanced Semiconductors & the University of Florida to Present on Hybrid Bonding Reliability at the 2026 Electronic Components & Technology Conference in Orlando
- Wooptix Targets AI Packaging Bottleneck with Astronomy Tech