Signal Integrity Designs at Organic Interposer CoWoS-R for HBM3-9.2Gbps High Speed Interconnection of 2.5D-IC Chiplets Integration

May. 30, 2024 -- Congratulations on the GUC's paper acceptance by IEEE and our member's invitation to present at the 74th ECTC on May 31st, 2024.

We (GUC) will present our high speed integrated design (signal integrity) solution for HBM3E-9.2Gbps on organic interposer technology. The paper will also be filled at IEEE Xplorer Digital Library (https://ieeexplore.ieee.org/Xplore/home.jsp). (The link will be updated after the 74th ECTC)

Paper Title: Signal Integrity Designs at Organic Interposer CoWoS-R for HBM3-9.2Gbps High Speed Interconnection of 2.5D-IC Chiplets Integration

Content

• Introduction
• HBM3 SI Design Flow and Optimization
• The proposed GSG-interleaved T-lines at CoWoS-R 
• HBM3 High Speed Interconnection Design
• Design-of-Experiments at Interconnect Routing Rules
• Interconnect Post-Layout Simulation 
• Insertion loss / Crosstalk Characterization
• FoMsof High Speed Interconnect Design
• Eye-diagram Co-Simulation
• Measurement and Correlation
• Conclusion

Remark

IEEE is the world's largest technical professional organization dedicated to advancing technology for the benefit of humanity. 

Remark

The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society.