Understanding 3DIC, Heterogeneous Integration, SiP, and Chiplets at Once
The semiconductor industry enters the era of integration. Various foundries are focusing on advanced packaging technologies, but the terminology surrounding advanced packaging can be daunting. This article aims to explain these terms in the simplest way possible.
According to a report from TechNews, currently, there are two main trends in advanced packaging: heterogeneous integration and chiplets.
In fact, the concept of “heterogeneous integration” has been developing for many years and is not exclusive to advanced packaging. It is not only used for the integration of heterogeneous chiplets but also for integrating other non-chip active/passive components into a single package, which is the technology commonly used in traditional Outsourced Semiconductor Assembly and Test Services(OSATs).
To read the full article, click here
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related News
- TSMC to Provide 3DIC Integration for AI Chips in 2027, Featuring 12 HBM4 and Chiplets Manufactured with A16
- What Exactly Are Chiplets And Heterogeneous Integration?
- Five workflows for tackling heterogeneous integration of chiplets for 2.5D/3D
- The Era of Heterogeneous Integration Approaches: Who Shall Dominate the Advanced Packaging Field?
Latest News
- Xanadu and Tower Semiconductor Deepen Strategic Collaboration to Accelerate Photonic Quantum Hardware Innovation
- EV Group Unveils Next-Generation EVG®120 Resist Processing System for High-Volume Manufacturing
- CEA Demonstrates First Dynamically Routed Electro-Optical Router for Photonic Interposers
- Renesas Develops SoC Technologies for Automotive Multi-Domain ECUs Essential for the SDV Era
- Keysight Unveils 3D Interconnect Designer for Chiplet and 3DIC Advanced Package Designs