Understanding 3DIC, Heterogeneous Integration, SiP, and Chiplets at Once
The semiconductor industry enters the era of integration. Various foundries are focusing on advanced packaging technologies, but the terminology surrounding advanced packaging can be daunting. This article aims to explain these terms in the simplest way possible.
According to a report from TechNews, currently, there are two main trends in advanced packaging: heterogeneous integration and chiplets.
In fact, the concept of “heterogeneous integration” has been developing for many years and is not exclusive to advanced packaging. It is not only used for the integration of heterogeneous chiplets but also for integrating other non-chip active/passive components into a single package, which is the technology commonly used in traditional Outsourced Semiconductor Assembly and Test Services(OSATs).
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