Can Chiplets Serve Cost-Conscious Apps?
The economics are not yet clear for industrial or consumer electronics.
By Bryon Moyer, Semi Engineering | April 17th, 2025
Chiplets are emerging as a significant new phase in the evolution of the semiconductor market, providing a way to continue scaling performance well beyond the size limitations of a reticle. But that improvement comes with a high price tag and a lot more complexity, which so far has limited adoption.
One of the main reasons for the cost increase is the need for advanced packaging when employing chiplets, which represents a fundamental shift in how semiconductors are designed, built, and tested. It requires extra time, effort, expertise, and experimentation, because there are no set recipes. Standards eventually may help mitigate the risk, but it’s not clear whether the cost of advanced packaging will ever beat that of traditional packaging.
To read the full article, click here
Related Chiplet
- Integrated voltage regulator (IVR) chiplet
- High-performance connectivity chiplets
- eFPGA Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
Related News
- Can Chiplets Solve Semiconductor Challenges?
- Chiplets Make Case for More Apps
- Arm: Chiplets Can’t Deliver on TCO Without an Ecosystem
- ASIC platform targets automotive chiplets
Latest News
- Tessolve and Intel Foundry Collaborate on Enablement for EMIB Advanced Packaging Technology
- Intel and Lens Technology Collaborate to Enable Advanced Semiconductor Packaging for the AI Era
- Amkor Technology Announces Strategic Partnership with NVIDIA to Expand Advanced Packaging and Test for Next-Generation AI Infrastructure
- Synopsys Enables AMD Instinct™ MI455X GPU Design with Comprehensive Multi-Die Solution
- AI Data Centers Push Silicon Photonics Toward 300-mm Scale