Chiplet Interconnects Add Power And Signal Integrity Issues
More choices, interactions, and tiny dimensions create huge headaches.
By Adam Kovac, Semi Engineering (December 12th, 2024)
The flexibility and scalability offered by chiplets make them an increasingly attractive choice over planar SoCs, but the rollout of increasingly heterogeneous assemblies adds a variety of new challenges around the processing and movement of data.
Nearly all of the chiplets in use today were designed in-house by large systems companies and IDMs. Going forward, third-party chiplets will begin showing up in designs, as well, including some made by different foundries, and some pre-integrated with other chiplets into subsystems. This will significantly change the integration challenges, and it will require flexibility in the tools, assembly processes, and testing strategies, as well as the designs themselves.
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