Signal Integrity Plays Increasingly Critical Role In Chiplet Design
Chiplet design engineers have complex new considerations compared to PCB concepts.
By Ann Mutschler, SemiEngineering (February 13th, 2025)
Maintaining the quality and reliability of electrical signals as they travel through interconnects is proving to be much more challenging with chiplets and advanced packaging than in monolithic SoCs and PCBs.
Signal integrity is a fundamental requirement for all chips and systems, but it becomes more difficult with chiplets due to reflections, loss, crosstalk, process variation, and various types of noise and physical effects. Electrical signals need to arrive at their destination at the right time, waveform shape, and with consistent voltage levels. This was hard enough in monolithic chips, but it takes on a whole new dimension in advanced packages.
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