2.5D Integration: Big Chip Or Small PCB?
By Brian Bailey, Semi Engineering (February 29th, 2024)
The industry is divided about the right materials, methodologies, and tools for interconnecting chiplets, and that can cause problems.
Defining whether a 2.5D device is a printed circuit board shrunk down to fit into a package, or is a chip that extends beyond the limits of a single die, may seem like hair-splitting semantics, but it can have significant consequences for the overall success of a design.
To read the full article, click here
Related Chiplet
- eFPGA Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
Related News
- imec: New Methods for 2.5D and 3D Integration
- Avalanche Technology and NHanced Semiconductors Leverage Advanced 2.5D Integration to Bring Optimal SWaP and Reliability to Rad-Hard FPGAs
- Signal Integrity Designs at Organic Interposer CoWoS-R for HBM3-9.2Gbps High Speed Interconnection of 2.5D-IC Chiplets Integration
- Five workflows for tackling heterogeneous integration of chiplets for 2.5D/3D
Latest News
- Applied Materials Introduces New Systems to Accelerate DRAM and Advanced Packaging for AI Chips
- Quantum Computing Inc. Completes Acquisition of NHanced Semiconductors, Inc.
- GlobalFoundries qualifies SLATE™ advanced packaging technology on 9SW platform for next-generation radio frequency applications
- Qnity Powers the Transition from Shrink to Stack with Advanced Packaging Solutions
- NHanced Semiconductors President Robert Patti to Deliver Plenary Presentation on the Critical Role of Advanced Packaging at the 2026 Lithography Workshop