2.5D Integration: Big Chip Or Small PCB?
By Brian Bailey, Semi Engineering (February 29th, 2024)
The industry is divided about the right materials, methodologies, and tools for interconnecting chiplets, and that can cause problems.
Defining whether a 2.5D device is a printed circuit board shrunk down to fit into a package, or is a chip that extends beyond the limits of a single die, may seem like hair-splitting semantics, but it can have significant consequences for the overall success of a design.
To read the full article, click here
Related Chiplet
- High Performance Droplet
- Interconnect Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Bridglets
- Automotive AI Accelerator
Related News
- imec: New Methods for 2.5D and 3D Integration
- Signal Integrity Designs at Organic Interposer CoWoS-R for HBM3-9.2Gbps High Speed Interconnection of 2.5D-IC Chiplets Integration
- Five workflows for tackling heterogeneous integration of chiplets for 2.5D/3D
- CEA Combines 3D Integration Technologies & Many-Core Architectures to Enable High-Performance Processors That Will Power Exascale Computing
Latest News
- Cadence Launches Partner Ecosystem to Accelerate Chiplet Time to Market
- Ambiq and Bravechip Cut Smart Ring Costs by 85% with New Edge AI Chiplet
- TI accelerates the shift toward autonomous vehicles with expanded automotive portfolio
- Where co-packaged optics (CPO) technology stands in 2026
- Qualcomm Completes Acquisition of Alphawave Semi