UMI: Extending Chiplet Interconnect Standards To Deal With The Memory Wall

By Ramin Farjadrad, Eliyan

October 15, 2024

With the Open Compute Project (OCP) Summit upon us, it’s an appropriate time to talk about chiplet interconnect (in fact the 2024 OCP Summit has a whole day dedicated to the multi-die topic, on October 17). Of particular interest is the Bunch of Wires (BoW) interconnect specification that continues to evolve.

At OCP there will be an update and working group looking at version 2.1 of BoW. (That will be at 9:45 a.m. on Thursday, October 17, followed later that day by an overview of a solution called the Universal Memory Interface that can be added to BoW to specifically target the growing memory wall challenge facing multi-die design.) We believe all memory-bound SiP designs can benefit from advantages offered by UMI. Here’s why it’s important:

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