Advancing 3D IC Design for AI Innovation

By Dan Kochpatcharin, TSMC

September 27, 2024

We are on the brink of an AI-driven era, with soaring demand for high-performance AI chips in data centers. In fact, one could argue that there has never been a better time to be in the semiconductor industry, as our innovations are unlocking tremendous opportunities in artificial intelligence.

As next-generation AI chip designs grow larger and more complex, the market’s timeframes continue to tighten, heightening the need for advanced chips that are both more powerful and energy-efficient. At the TSMC 2024 North America Open Innovation Platform^® (OIP) Ecosystem Forum, we met with both design partners and customers to explore how TSMC and the broader semiconductor sector are collaborating to tackle these challenges and seize emerging opportunities.

TSMC is advancing the 3D IC design ecosystem to foster system-level innovation through enhanced collaboration with partners, customers, and foundries. Working with our OIP ecosystem partners, we are utilizing AI and machine learning to significantly improve 3D IC design productivity and optimize design power, performance, area (PPA), and quality of results (QoR). As a proud member of the 3Dblox committee, we are working with other committee members to drive the next evolution of the 3Dblox standard, significantly boosting the 3D IC design efficiency and pushing the industry forward. Together with our OIP partners, we are tackling the multi-physics challenges inherent in 3D IC architectures, helping our mutual customers achieve precise and optimized designs on the latest TSMC 3DFabric^® technologies.

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