NHanced Semiconductors - Chiplet Ecosystem

If your product would benefit by 3D architecture, a smart interposer, chiplet integration, or other advanced packaging, let NHanced Semiconductors be your complete supply chain solution.  We provide turnkey assemblies and components including custom design, design consultation, TSV insertion, and access to the latest and best semiconductor technologies.  Take advantage of our deep experience in 3D and 2.5D enablement.  We do multi-die design, assembly, sourcing, packaging, final test – everything you need to carry your project from original idea to beautiful finished device.