NHanced Capabilities

NHanced Capabilities
NHanced Background
NHanced Semiconductors
New Tools and Capabilities - Highlights
AP Services: Bonding
DBI®: Low Temperature Hybrid Bonding Process
Hybrid Bonding Interconnect Pitch Scaling
AP Services: Interposers
AP Services: Embedded 2.5/3D ─ Wafer Reconstitution
NHanced Supports Many More Than Moore Technologies
AP Services: Chiplets
AP Services: Micro-Connections and 3D Structures
AP Services: Microfluidics and Cooling
AP Market Drivers: Photonics & Quantum
AP Market Drivers: Intelligent Sensors and Edge Compute
NHanced Small/Medium Scale – High Touch Manufacturing
NHanced Standard Capabilities