NHanced Semiconductors President Robert Patti to Detail “Foundry 2.0” at SEMIEXPO Heartland

New manufacturing model extends Moore’s Law via advanced packaging, employing a range of 3D IC processes

INDIANAPOLIS, IN - MARCH 31, 2025 – At the upcoming SEMIEXPO Heartland conference, NHanced Semiconductors president Robert Patti will present on the critical role of advanced packaging in continuing the progress of Moore’s Law in semiconductor development. According to Patti, transistor scaling alone no longer delivers meaningful benefits in economics, speed, and effective chip size.

“In Gordon Moore’s seminal paper, he predicted a ‘Day of Reckoning’ for semiconductor scaling,” explained Patti. “That day has arrived. However, as predicted, there is another path forward for semiconductors to continue progress without relying solely on ever-shrinking devices. Advanced packaging is that new path, and it is at the heart of a new industry model known as Foundry 2.0.”

In his address, Patti will detail Foundry 2.0’s new path forward for the electronics industry – bringing together the best of all technologies and material solutions by using the interconnect and manufacturing methods typically used in building semiconductor devices themselves. Thus, Foundry 2.0 sources best-of-class components from traditional foundries and combines them in novel and powerful assemblies. This foundry evolution, based on Advanced Packaging (AP), it is inherently different from today’s traditional semiconductor foundry model. This radical shift expands the advanced packaging tool box to integrate heterogeneous components in 3D and 2.5D devices, leveraging application specific chiplets for cost reduction and innovation.

NHanced Semiconductors is the first US-based pure-play advanced packaging foundry to employ this revolutionary Foundry 2.0 business model.

SEMIEXPO Heartland, SEMI’s first Midwestern U.S. exposition, will be held April 1-2 at the Indiana Convention Center in Indianapolis. Its conference program highlights the latest developments in smart manufacturing and smart mobility. This event will bring together leaders from both areas to explore strategies for collaboration and innovation, fostering growth and new business opportunities in this thriving hub for semiconductor manufacturing.

About NHanced Semiconductors, Inc.

NHanced Semiconductors is the first pure-play advanced packaging foundry in the US, specializing in leading-edge BEoL semiconductor technologies. Its capabilities include chiplets, 3D-ICs, silicon interposers, 2.5D, additive silicon manufacturing, photonics, microfluidics, and other innovative technologies. The foundry works with both standard and non-standard substrates, III‑V compound semiconductors, and many specialized materials.

Headquartered in Illinois, NHanced has a development and manufacturing facility near Research Triangle Park, NC, performing small volume manufacturing, in-house process development, and customer prototyping, and an advanced packaging and assembly facility in Odon, IN. For more information, please visit: https://nhanced-semi.com/