Foundry 2.0 – the New Path Forward for Moore’s Law
May 11, 2025
NHanced Semiconductor president Robert Patti’s presentation at the recent SEMIEXPO Heartland in Indianapolis, IN described the critical role of advanced packaging in continuing the progress of Moore’s Law in semiconductor development. Following is a summary of his presentation.
In Gordon Moore’s seminal paper, he predicted a ‘Day of Reckoning’ for semiconductor scaling. That day has arrived. However, as predicted, there is another path forward for semiconductors to continue progress without relying solely on ever-shrinking devices. Advanced packaging is that new path, and it is at the heart of a new industry model known as Foundry 2.0.
To read the full article, click here
Related Chiplet
- High Performance Droplet
- Interconnect Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Bridglets
- Automotive AI Accelerator
Related Blogs
- Chiplet Summit 2024: Opportunities, Challenges, and the Path Forward for Chiplets
- The Chiplet Center of Excellence sets new standards for the automotive industry
- A look back at the Automotive Chiplet Forum 2025
- The Chiplet Economy: Three Pillars for Semiconductor Success
Latest Blogs
- Advancing Europe’s Automotive Chiplet Vision: Arteris Joins CHASSIS to Accelerate Software-Defined Mobility
- 3D-IC Market Outlook: Technology Roadmaps, Readiness, and Design Implications
- Cadence 3D-IC Success Stories: Faster Bandwidth, Lower Power, On-Time Tapeouts
- 3D-IC Test and Reliability: KGD Strategies, Access Architecture, & Failure Mode
- 3D-IC in AI, HPC, and 5G: Bandwidth, Latency, and Energy per Bit Advantages