Multi-Die Systems Reshape Semiconductor Innovation

By Shekhar Kapoor, Synopsys 
ElectronicDesign (Oct. 3, 2023)

Demands have never been higher for—and on—semiconductors. From smart speakers to self-driving cars and robotic manufacturing equipment, chips are elevating our smart everything world to new heights. In 2021, the semiconductor industry marked a record by shipping 1.15 trillion chips. Increasingly, as applications become more intelligent, these chips are being asked to deliver much more processing prowess, better power efficiency, and, for space-constrained designs, smaller footprints.

It’s a promising and exciting time for the electronics industry, with transformer models, generative artificial intelligence (AI), and immersive experiences creating unprecedented demand for compute and data rates at ever lower power levels. As a result, new players are entering the chipmaking landscape and bringing to life innovations that are transforming the way we learn, work, play, and, when you think about it, live.

However, all of these chipmakers are facing deep limitations as Moore’s Law slows, particularly for designs targeting compute-intensive workloads.

The reality is, migrating traditional, monolithic semiconductor designs to smaller process nodes is no longer generating the benefits that such scaling once did. And attempting to do so will even hit manufacturing walls.

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