GSCM 2024: Interview with A.M. Fitzgerald and Associates' Alissa Fitzgerald
In this interview, Nitin Dahad sat down with Alissa Fitzgerald to talk about through-silicon vias, chiplets, 3D-ICs, and how these "new" technologies originated from MEMS technologies developed decades ago.
Related Videos
- Live with Cadence talking AI, Chiplets, Virtual Prototyping and more at Embedded World 2024
- Electronica 2024 - Shaping the Future of Automotive Electronics with Chiplets and Sustainability
Latest Videos
- Revolutionizing SoC Design: The Shift to Chiplet-Based Architectures
- Embedded World, Nuremberg: Arm’s Suraj Gajendra on AI, Chiplets, and the Future of Automotive Compute
- Keysight Expands Chiplet Interconnect Support with UCIe 2.0 & BoW
- Revolutionizing AI & Chiplets: Baya Systems CEO on $36M Series B, UALink, Future of Data Movement
- Machine Learning Applications in EDA for Chiplet Reliability